High-reliability electronics
Develop downhole electronics for 175°C and above with component screening and DFM in mind.
Markets
Marine & Oilfield Technology
Custom electronics and integrated systems for demanding marine and oilfield environments.
Bryantech approach
Integrated thinking. Practical delivery.
We bring the relevant engineering disciplines together around the application, measurable requirements and a realistic path to production.
Harsh-environment requirements
Define thermal, vibration and mechanical requirements around the operating environment.
Testing, traceability and lifecycle support
Plan verification, record results and maintain configuration information through the product lifecycle.
Designed around the operating environment
From component selection to assembly and test planning.
Component selection & screening
Global component options evaluated for temperature, electrical margins, lifecycle and application requirements.
High-temperature design
Hardware architecture, power, sensing and interfaces developed around downhole conditions.
DFM & assembly
Production experience applied to PCB/PCBA, assembly, fixtures and process controls.
Reliability validation
Thermal cycling, powered burn-in, high-temperature screening and vibration test planning.
Representative design architectures
Sonic logging drive electronics, resistivity logging PCBA and density logging PCBA. These illustrate engineering approaches; project-specific results are reviewed against the applicable requirements.
Test conditions and evidence
A structured reference plan for high-temperature electronics.
| Test | Reference conditions | Verification |
|---|---|---|
| Temperature cycling | −20°C to 175°C; at least 300 cycles; unpowered | Functional checks after cycling |
| Powered high-temperature soak | 175°C; 2,000 hours | Monitor critical signals and verify operation after testing |
| Hot vibration | 175°C example condition; 20 grms; 5–500 Hz; 4 hours per axis, three axes | Powered monitoring and post-test functional checks |
Reference test conditions from our engineering plan. Project acceptance is based on recorded test results. Requirements above 175°C are defined and verified for the intended operating environment.
Screening and verification workflow
Component choices and test evidence remain connected throughout development.
- 01
Select
Review device ratings, electrical margins and sourcing options.
- 02
Screen
Apply the agreed high-temperature and aging screening plan.
- 03
Integrate
Evaluate the assembled PCBA, interfaces and fixtures.
- 04
Verify
Record results, investigate failures and repeat checks.
Reference test implementation
Conditions are part of a test plan, not a claim of completed qualification.
Thermal cycling
The supplied reference plan uses −20°C to 175°C, a 60-minute ramp and a dwell of at least 120 minutes, for at least 300 unpowered cycles.
Powered soak
At 175°C, the reference plan specifies 2,000 hours with monitoring of critical DAC/POL behaviour and post-test functional checks.
Hot vibration
The PCBA is installed in its fixture/sonde assembly. The reference is 20 grms over 5–500 Hz for four hours per axis, across three axes, with heat and powered monitoring.
Acceptance evidence
Document conditions, configuration, measurements and any failures. Higher-temperature requirements and project-specific acceptance criteria are defined separately.
Build what comes next